Product Code Database
Example Keywords: coat -gran $82-108
   » » Wiki: Cleavage (crystal)
Tag Wiki 'Cleavage (crystal)'.
Tag

Cleavage (crystal)
 (

Cleavage, in and materials science, is the tendency of materials to along definite structural planes. These planes of relative weakness are a result of the regular locations of and in the crystal, which create smooth repeating surfaces that are visible both in the microscope and to the naked eye. If in certain directions are weaker than others, the crystal will tend to split along the weakly bonded planes. These flat breaks are termed "cleavage".Hurlbut, Cornelius S.; Klein, Cornelis, 1985, , 20th ed., Wiley, The classic example of cleavage is , which cleaves in a single direction along the basal pinacoid, making the layers seem like pages in a book. In fact, mineralogists often refer to "books of mica".

and provide examples of cleavage. Each is composed solely of a single , . In diamond, each carbon atom is bonded to four others in a tetrahedral pattern with short . The planes of weakness (cleavage planes) in a diamond are in four directions, following the faces of the . In graphite, carbon atoms are contained in layers in a hexagonal pattern where the covalent bonds are shorter (and thus even stronger) than those of diamond. However, each layer is connected to the other with a longer and much weaker van der Waals bond. This gives graphite a single direction of cleavage, parallel to the basal pinacoid. So weak is this bond that it is broken with little force, giving graphite a slippery feel as layers shear apart. As a result, graphite makes an excellent .

While all will show some tendency to split along atomic planes in their crystal structure, if the differences between one direction or another are not large enough, the mineral will not display cleavage. , for example, displays no cleavage.


Types of cleavage
Cleavage forms parallel to crystallographic planes:

  • Basal, pinacoidal, or planar cleavage occurs when there is only one cleavage plane. has basal cleavage. (like or ) also has basal cleavage; this is why mica can be peeled into thin sheets.
  • Prismatic cleavage occurs when there are two cleavage planes in a crystal (but not three). is an example where the planes meet at a 90 degree angles. is an example where the planes intersect at 56° and 124°.
  • cleavage occurs when there are three cleavage planes intersecting at 90 degrees. (or ) has cubic cleavage, and therefore, when halite crystals are broken, they will form more cubes.
  • cleavage occurs when there are three cleavage planes intersecting at angles that are not 90 degrees. has rhombohedral cleavage.
  • cleavage occurs when there are four cleavage planes in a crystal. exhibits perfect octahedral cleavage. Octahedral cleavage is common for . also has octahedral cleavage.
  • Dodecahedral cleavage occurs when there are six cleavage planes in a crystal. has dodecahedral cleavage.


Parting
Crystal parting occurs when minerals break along planes of structural weakness due to external stress, along composition planes, or along planes of weakness due to the of another mineral. Parting breaks are very similar in appearance to cleavage, but the cause is different. Cleavage occurs because of design weakness while parting results from growth defects (deviations from the basic crystallographic design). Thus, cleavage will occur in all samples of a particular mineral, while parting is only found in samples with structural defects. Examples of parting include the octahedral parting of , the rhombohedral and basal parting in , and the basal parting in .


Uses
Cleavage is a physical property traditionally used in mineral identification, both in hand-sized specimen and microscopic examination of rock and mineral studies. As an example, the angles between the prismatic cleavage planes for the pyroxenes (88–92°) and the (56–124°) are diagnostic.

Crystal cleavage is of technical importance in the industry and in the cutting of .

Precious stones are generally cleaved by impact, as in .

Synthetic single crystals of semiconductor materials are generally sold as thin wafers which are much easier to cleave. Simply pressing a wafer against a soft surface and scratching its edge with a scribe is usually enough to cause cleavage; however, when dicing a wafer to form chips, a procedure of scoring and breaking is often followed for greater control. Elemental semiconductors (, , and diamond) are , a for which octahedral cleavage is observed. This means that some orientations of wafer allow near-perfect rectangles to be cleaved. Most other commercial semiconductors (, InSb, etc.) can be made in the related zinc blende structure, with similar cleavage planes.


See also
  • Cleavage (geology)


External links

Page 1 of 1
1
Page 1 of 1
1

Account

Social:
Pages:  ..   .. 
Items:  .. 

Navigation

General: Atom Feed Atom Feed  .. 
Help:  ..   .. 
Category:  ..   .. 
Media:  ..   .. 
Posts:  ..   ..   .. 

Statistics

Page:  .. 
Summary:  .. 
1 Tags
10/10 Page Rank
5 Page Refs
1s Time